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Pragmatic, in collaboration with Harvard University and specialists in hardware, software and system development, Qamcom, have demonstrated the world’s first 32-bit microprocessor in a flexible technology that is fully functional while flexed. It’s also the first flexible microprocessor with embedded machine learning capabilities.
Cost and form-factor have long prohibited item-level intelligence for applications such as fast-moving consumer goods, wearables or single-use healthcare equipment, despite the minimal computational requirements for the functionality required.
Published in Nature journal, this research ushers in a step-change in the art of the possible for flexible electronic systems.
Flexing RISC-V Instruction Subset Processors (RISPs) to Extreme Edge
Publication Date: October 2026
A Bendable Non-silicon RISC-V Microprocessor
Publication Date: September 2024
Malodour classification with low-cost flexible electronics
Publication Date: February 2023
Exploiting short application lifetimes for low cost hardware encryption in flexible electronics
Publication Date: April 2023
FlexiCores: low footprint, high yield, field reprogrammable flexible microprocessors
Publication Date: June 2022
Flexible SAR ADC with resistive DAC for Conformable On-Body Sensing Applications
Publication Date: October 2022
Two-stage resistor-load logic for digital applications on flexible substrates
Publication Date: June 2021
A natively flexible 32-bit Arm microprocessor
Publication Date: July 2021
49.35 MHz GBW and 33.43 MHz GBW amplifiers in flexible a-IGZO TFT technology
Publication Date: July 2020
A hardwired machine learning processing engine fabricated with submicron metal-oxide thin-film transistors on a flexible substrate
Publication Date: July 2020
Binary Neural Network as a Flexible Integrated Circuit for Odour Classification
Publication Date: August 2020
Bespoke Machine Learning Processor Development Framework on Flexible Substrates
Publication Date: July 2019
Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits
Publication Date: June 2019
Thermosonic-Adhesive (TS-A) Integration of Flexible Integrated Circuits on Flexible Plastic Substrates
Publication Date: September 2018