Applications

Smart packaging

Enhance customer experiences with just one tap of a smartphone.

Embedded directly into packaging, ultra-thin FlexICs are imperceptible to the touch. They don’t encroach on product packaging, giving more area for promotion. And their unique ID can’t be covered or replaced. Low cost and low carbon, they’re ideal for deployment at scale. Drive loyalty and create frictionless customer experiences. Just one tap unlocks personalised content tailored to location, season, and past interactions, fuelling deeper engagement and driving brand loyalty and growth.

Use cases

Unlock smart functionality

Consumer engagement

Create a seamless transition between the physical and digital brand experience. Just one tap unlocks personalised content tailored to location, season, and past interactions, fuelling deeper engagement and driving brand loyalty.

Smart reusable packaging

Due to cost, smart reusable packaging has typically been reserved for high-value items. Low-cost FlexICs deliver granular, asset-level data in a low carbon footprint, unlocking the potential for reusable packaging at scale.

Tamper detection

Strengthen brand trust and build consumer confidence with FlexIC tamper-detect functionality. One-tap verification ensures product integrity, providing real-time assurance of authenticity and safety.

Digital product passport

Smart digital IDs give customers instant access to a product’s complete history. Through a simple tap of smartphone, they enable informed purchasing decisions while combating counterfeiting and promoting sustainability.

Authentication 

Seamless, secure authentication enhances transparency, protects brand reputation, and delivers consumer peace of mind. FlexICs’ ultra-thin form factor provides low-profile protection that can’t be easily damaged in transit. Embedded into products or packaging, FlexICs ensure authenticity, combat counterfeiting, and build consumer trust.

Technology platform

FlexIC Platform Gen 3

Pragmatic FlexIC Platform Gen 3 delivers the tools you need to quickly design and manufacture mixed-signal ASICs, from technology data and rules files to device models compatible with leading EDA simulation tools.
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