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Accelerate innovation and get to market faster

Foundry

Achieve optimal performance fast with the FlexIC Foundry’s unprecedented workflow speeds, taking your design from tape-out to delivery in just weeks. Our advanced manufacturing site, Pragmatic Park – the UK’s first 300mm semiconductor fabrication site – has capacity to host up to nine fabrication lines, each capable of producing billions of chips per year.

Transform ASIC development with fast, affordable fabrication

FlexICs use thin-film transistor (TFT) technology and industry-standard application-specific integrated circuit (ASIC) design flows to bring your designs to life.

Ultra-thin and physically flexible, they open new use cases and enable system miniaturisation for more compact, integrated designs.

With low non-recurring engineering costs and industry-leading turnaround times, custom FlexICs deliver connect, sense and compute capabilities so you can create innovative products – fast.

Sustainable fabrication

Our unique low-temperature fabrication and short cycle times eliminate the energy-intensive processes of standard semiconductor manufacturing, helping to drive down the carbon impact of your products.

We also use renewable energy, while optimising our processes to minimise waste generation and maximise recycling and reuse – with a special focus on the reduction of organic solvents.

Less energy

Low temperatures and fewer process steps drive down energy consumption.

Less water

Lower temperatures mean less cooling and less ultra-pure water.

Fewer harmful chemicals

Reducing environmental impact.

Download our Advancing Semiconductor Sustainability report here (PDF)

Meet FlexIC interconnects

A high-density integration platform built for the next generation of ultra-compact systems. Shrink your PCB footprint. Free up space for what matters.
Discover FlexIC interconnects
FlexIC Interconnects

Use cases

Heart health tracking

Stroke is the second leading cause of death globally. Smart patches, based on FlexICs, are cost-effective, comfortable and enable preventative monitoring to improve outcomes in at-risk patients.

Predictive maintenance

Tag machinery parts with FlexICs to log usage and wear, enabling proactive maintenance and preventing costly downtime.

More ergonomic designs

Custom FlexICs enable miniaturisation by integrating bulky components into sleek, ultra-thin systems-on-chips (SoCs), creating lighter, versatile, and highly integrated devices.

Intelligence in new spaces

FlexICs’ flexible form factor brings novel functionality into new spaces, minimising increases in size or weight and taking intelligence where it couldn’t go before.

Ready to start designing?

Request the PDK

Everything you need for design success, from technology data and rules files to device models compatible with leading EDA simulation tools.

Request PDK access

Need help getting started?

Get support

Create customised designs at speed and scale. From product specification to full FlexIC characterisation – we can help.

Talk to us

FAQs

Can’t find what you’re looking for?
Contact us here:

info@pragmaticsemi.com

What are FlexICs?
FlexIC are integrated circuits built on a flexible polyimide substrate, with standard front-end devices and back-end routing/interconnects.

What size wafers do you manufacture?
We manufacture industry-standard 300 mm (12 inch) wafers on a reusable glass carrier.

Where is your foundry located?

Our flagship, high-volume production facility, Pragmatic Park, is located in Durham, UK.

What is a typical wafer cycle time?

Our wafers take only days to manufacture, allowing customers to go from tape out to delivery in just a few weeks.

How do you ensure the quality of wafers?
Each wafer goes through a wafer acceptance test to ensure it meets specification. Wafer acceptance criteria and test data for each wafer are shared upon shipment.

What reliability testing and qualification standards do you follow?
We follow typical Joint Electron Device Engineering Council (JEDEC) standards and test methods. This includes extensive wafer-level reliability tests, as well as passive, storage and aging tests on all delivery formats.

What cleanroom classification do you have?
Our cleanroom meets the ISO 7 standard. Our front-opening unified pods (FOUPs), used for automated wafer transportation, meet ISO3.

What technical support do you offer?

Our dedicated engineering support can help you take designs from concept to high-volume manufacturing as quickly and easily as possible. We can help at every step of the way, from getting started with the PDK, to design feasibility, design for manufacturability and yield optimisation.

Technology platform

Introducing FlexIC Platform Gen 3

Meet our FlexIC PDK with an overview from our Senior Director of Design Platform, Dave Verity.

Meet the technology with an overview from our SVP Technology, Catherine Ramsdale.

Gen 3 promo image
Gen 3 promo image

Explore FlexIC Platform Gen 3

Pragmatic FlexIC Platform Gen 3 delivers the tools you need to quickly design and manufacture mixed-signal ASICs, from technology data and rules files to device models compatible with leading EDA simulation tools.
Find out more

Academic and research institutions

Multi-project wafers

Get dedicated and multi-project wafer runs from EUROPRACTICE, our official partner for design innovation.

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Ideate
Conceptualise
Validate
Optimise
Integrate
Verify
Fabricate
Ideate
Conceptualise

Fab-as-a-service

The future of distributed chip manufacture starts here

Fab-as-a-Service (FaaS) is our unique solution for the future of distributed semiconductor manufacturing, providing the most attainable route to semiconductor sovereignty and cost-effective, scalable fabrication.

FaaS delivers consistent, localised, high-volume semiconductor production in a concentrated footprint. With capital costs an order of magnitude lower than a silicon equivalent, these modular fabs can be constructed and commissioned in a fraction of the time.

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