FlexIC interconnects

Design smaller. Perform better.

Wearables are exploding. Ultra-compact IoT is accelerating. Devices are shrinking fast – but expectations aren’t. You need to pack more performance into less space. More features. More connectivity. More complexity.

Meet FlexIC interconnects – a high-density integration platform built for the next generation of ultra-compact systems.

It combines ultra-thin flexible materials with wafer-level semiconductor manufacturing, enabling ultra-fine routing and integrated passives. So you can route more signals – and more components – in less space.

Reduce discrete component count, area and cost. Integrate capacitors, resistors, and inductors directly into the interconnect layer.

• Shrink your PCB footprint. Free up space for what matters.
• Integrate passives directly into the substrate.
• Cut your bill of materials (BOM) and streamline assembly.
• Improve electrical performance and signal integrity.

No unnecessary friction. Just a smarter foundation for your system.

Unlock new design possibilities

The FlexIC interconnect platform becomes part of the integration architecture. The adaptable form factor fits seamlessly into products, giving you greater design freedom.

Capabilities include:

• High-density routing
• Impedance-matched transmission lines
• Fine-pitch bond pads
• Integrated passives
• Flexible form factor

The result? Smaller modules without sacrificing functionality or performance.

Rethink system-level integration

Integration doesn’t have to limit you. With FlexIC interconnects, it becomes your advantage.

Module size is driven by routing limits, discrete passives, and component spacing

FlexIC interconnects enable high-density routing and fine-pitch I/O

Tighter component spacing shrinks layout

Integrate passives into FlexIC to reduce surface components, assembly steps and save area

Consolidate functions into a compact System-in-Package on a highly integrated substrate

Deliver a compact system in a significantly smaller module footprint

Build smaller wearables without compromise

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More function, less space. Redefine system integration with FlexIC interconnects

Design smaller. Perform better.

Unlock new design possibilities

Rethink system-level integration

Build smaller wearables without compromise

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