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FlexIC Foundry

Redefine consumer electronics: build smaller, innovate faster

Advanced functionality. Ultra-compact devices. No compromises.

Consumer electronics are getting more complex, driving the need to rethink system-level design and integration. But as the footprint shrinks, the challenge grows: how to integrate ever more complexity without compromising form factor?

Introducing FlexICs: ultra-thin, physically flexible chips that deliver unprecedented miniaturisation without sacrificing performance. FlexICs go where existing solutions can’t. With the routing density of IC substrates and the pliability of flexible printed circuit boards (flex PCBs), they deliver high-density circuitry in untapped spaces – in a cost-effective, ultra-compact form.

• Shrink your design footprint
• Consolidate passive components; simplify integration
• Reduce time to market: prototype and scale in weeks

HDI in action

Our Senior Manager Emerging Applications, Adam Rearden, demonstrates the density, thickness, and flexibility of FlexIC-based HDI – all while running live video.

Our product and engineering experts explain how Pragmatic’s FlexICs are unlocking new levels of miniaturisation.

High-density interconnects

HDI FlexIC
Go beyond the routing density of traditional PCBs. As consumer electronics get thinner and smarter, system integration becomes a serious challenge. Traditional flex PCBs can’t keep up – limiting your ability to scale down without sacrificing form factor.
FlexICs deliver high routing density with unmatched flexibility. Their multi-layer interconnects provide compact, high-speed signal routing in space-constrained applications – so you can shrink your device without compromising on signal integrity or performance.
FlexIC thin
FlexIC thin

Integrated passives

Discrete passives eat up valuable PCB real estate, limiting form factor and system integration, while compromising aesthetics and user experience.

FlexICs consolidate resistors and capacitors into a single, ultra-thin flexible substrate – reducing layout complexity along with your bill of materials (BOM) enabling smaller, lighter designs without compromising function.

Features:
Dedicated resistor layer: 200 kΩ/sq
High-K dielectric MIMCAP: 4.5 fF/µm²

Line/spacing:
1/1µm

Via size:
1.5µm

Minimum pad pitch:
100µm

Typical layers:
four

Downloadable PDFs

HDI Technical Brief

Technical brief (PDF)
Flexible interconnects

1.0 mb
Integrated Passives Technical Brief

Technical brief (PDF)
Flexible integrated passives

1.0 mb

FAQs

Can’t find what you’re looking for? Contact us here

What is the difference between FlexICs and FPCs?
Flexible Integrated Circuits (FlexICs) are thin flexible mixed signal devices that are manufactured using semiconductor tools on 300mm wafers. With n-type TFTs, dedicated resistors and metal-insulator-metal capacitors, designers can create mixed signal ASICs or high-density substrates that enable circuitry to be integrated in compact form factors.

What is the reliability and operating temperature range of a FlexIC?
We follow typical JEDEC standards for semiconductor reliability and test methods for front and back-end processes. Our FlexIC Platform Gen 3 has an operating temperature range of -10 to 80 degrees Celsius (°C).

What is the bend radius of a FlexIC and can it be used in wearables?
Our technology platform, FlexIC Platform Gen 3, can achieve a 5mm radius of curvature (ROC) for mixed signal active devices. Smaller ROC is possible dependant on device and routing density. Being thin and flexible makes FlexICs a good fit for wearable devices, allowing tight integration in compact assemblies.

Which mainstream EDA tools support FlexICs?

Our FlexIC Platforms used an industry standard process design kit and flow that is compatible with Cadence and Siemens EDA toolchains.

Spotlight applications

HDI interconnect

Advancing camera module design

Sensor-shift stabilisation is pushing camera modules to the limit. Connecting to a moving sensor in tight spaces creates new integration challenges.

FlexICs make it possible, enabling high-speed digital interconnects in tight spaces, without compromising actuator performance or stability.

Optimising form factor of smart rings

FlexICs are fully customisable and consolidate multiple discrete components – enabling analog front-ends, digital logic, and passives on a single chip.

Why FlexICs are different

Physically thin, flexible substrate

Four metal layers with vias for high-density routing

Pragmatic icon

Simplify systems and reduce BOM

Rapid semiconductor fabrication on 300mm wafers

Fully customisable

Pragmatic energy icon

Low carbon footprint

Rapid, low-carbon fabrication

Ready to innovate? The Pragmatic FlexIC Foundry makes customisation quick, cost-effective and sustainable.

Build, test, and scale at speed with production cycles that take days, not months. From developing proof of concepts to scaling a global product, the FlexIC Foundry accelerates innovation, cutting lead times so you can get to market faster – without the high set-up costs of traditional fabs. And it’s not just about speed. Our low-temperature process uses less energy and water, and fewer harmful chemicals, slashing the carbon footprint of fabrication – and your devices.

Watch the recording from our HDI webinar

Webinar: Hitting the limits of miniaturisation? Discover how FlexICs take you further!

Get the recording

Ready to get started? Speak to us

Our friendly foundry team look forward to hearing about your requirements

Enquire here

FAQs

Can’t find what you’re looking for? Contact us here

What are FlexICs?
FlexIC are integrated circuits built on a flexible polyimide substrate, with standard front-end devices and back-end routing/interconnects.

What size wafers do you manufacture?
We manufacture industry-standard 300 mm (12 inch) wafers on a reusable glass carrier.

Where is your foundry located?

Our flagship, high-volume production facility, Pragmatic Park, is located in Durham, UK.

What is a typical wafer cycle time?

Our wafers take only days to manufacture, allowing customers to go from tape out to delivery in just a few weeks.

How do you ensure the quality of wafers?
Each wafer goes through a wafer acceptance test to ensure it meets specification. Wafer acceptance criteria and test data for each wafer are shared upon shipment.

What reliability testing and qualification standards do you follow?
We follow typical Joint Electron Device Engineering Council (JEDEC) standards and test methods. This includes extensive wafer-level reliability tests, as well as passive, storage and aging tests on all delivery formats.

What cleanroom classification do you have?
Our cleanroom meets the ISO 7 standard. Our front-opening unified pods (FOUPs), used for automated wafer transportation, meet ISO3.

What technical support do you offer?

Our dedicated engineering support can help you take designs from concept to high-volume manufacturing as quickly and easily as possible. We can help at every step of the way, from getting started with the PDK, to design feasibility, design for manufacturability and yield optimisation.
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