Cost-effective, scalable fabrication
Semiconductors are critical components in just about every area of industry, but recent shortages of wafer materials have threatened the resilience of established international supply chains.
Fab-as-a-Service (FaaS) is Pragmatic’s unique solution for the future of distributed semiconductor manufacturing, providing the most attainable route to semiconductor sovereignty and cost-effective, scalable fabrication.
FaaS flexes to meet your business needs: rent a dedicated line for the duration of a project or buy your own fully managed ‘Fab-in-a-Box’.
The compact, self-contained design of the Fab-in-a-Box means it can be located exactly where it’s most needed, enabling consistent, localised, high-volume commercial production, irrespective of global shortages.
Requiring 100 times less capital expenditure than a silicon fab, and with 100 times faster process cycle time, the Fab-in-a-Box includes all the required process tools to deposit and pattern multiple high-quality material layers, integrated with a robotic wafer handling system inside a self-contained clean environment.
Detailed material recipes, end-to-end process flows, in-line quality monitoring and feedback control loops are implemented within the equipment and automation software to ensure reliable production without operator intervention.
Sustainable manufacturing white papers
White Paper: Intelligent Low-Carbon Semiconductor Manufacturing
This white paper explains Pragmatic’s world-leading approach to making our semiconductor manufacturing process more sustainable with the help of Industry 4.0 knowhow.
White Paper: Life Cycle Analysis of FlexICs
This white paper looks at the life cycle analysis of the FlexIC and explores why low carbon electronics are poised to play a significant role in implementing the ubiquitous Internet of Things.