Lower cost, lower carbon RFID
Develop next-generation RFID inlays
Our low cost, low carbon FlexICs have the potential to open up RFID opportunities in a far wider range of mass market applications. We’re offering label assemblers and converters our in-house Tag Assembly Line (TAL) resource to develop RFID inlay proofs of concept powered by our FlexIC technology.
Video: Introducing our in-house TAL service
Develop next-generation RFID inlay proof-of-concepts powered by our unique FlexIC technology.
About FlexICs
FlexICs – flexible integrated circuits – are a low-cost, low carbon, flexible alternative to traditional, silicon-based microchips.
FlexICs make it quick and easy to embed intelligence almost anywhere. Ultra-thin and highly cost-effective, they enable novel solutions that are simply not possible with conventional silicon semiconductors.
Perfect for bringing intelligence to low-cost items as part of the Internet of Things (IoT) – or anywhere ‘tiny technology’ is needed – FlexICs excel in applications such as smart packaging, recycling and reuse, traceability and product authentication.
