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FlexIC Foundry®

Pragmatic is revolutionising semiconductor fabrication with ultra-low-cost, flexible integrated circuit (FlexIC) technology that makes it quick and easy to embed intelligence almost anywhere.

Using thin-film transistor (TFT) technology in combination with conventional semiconductor processing equipment, our state-of-the-art, 300mm FlexIC Foundry® service takes FlexICs from tape-out to delivery in just four weeks, at a fraction of the cost of silicon.

Particularly suited to applications where form factor and cost outweigh speed and performance criteria, FlexICs excel in areas such as unique identification, multiplexing, driver circuitry, and basic computation.

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Process Design Kit: Helvellyn 2.1.0

This second-generation technology node offers four metal layers over a 600nm minimum channel dimension n-type FET process. The process also includes a dedicated resistor layer and capacitors. With an operating voltage of 3 VDC, the technology is ideal for enabling the Internet of Everything and is particularly suited to applications such as sensing and Radio Frequency Identification (RFID).

Our process design kit (PDK) contains devices, models and design rules, giving you everything you need to successfully design for FlexIC technology, and is fully compatible with industry-standard electronic design tools.

Download datasheet (PDF) Custom ICs

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Key features of FlexIC Foundry

Flexible ICs with ~30µm thickness

PDK compatible with standard industry EDA tools

Full device library available

Four metal layer stack for efficient interconnects

Standard cell library

Low NRE and fast production cycle time