Low-temperature processes reduce energy use

Low-temperature processes need less cooling

Fewer, shorter process steps reduce chemical use

Single-location production reduces carbon footprint

Create a seamless transition between the physical and digital brand experience. Just one tap unlocks personalised content tailored to location, season, and past interactions, fuelling deeper engagement and driving brand loyalty.

Due to cost, smart reusable packaging has typically been reserved for high-value items. Low-cost FlexICs deliver granular, asset-level data in a low carbon footprint, unlocking the potential for reusable packaging at scale.

Strengthen brand trust and build consumer confidence with FlexIC tamper-detect functionality. One-tap verification ensures product integrity, providing real-time assurance of authenticity and safety.

Smart digital IDs give customers instant access to a product’s complete history. Through a simple tap of smartphone, they enable informed purchasing decisions while combating counterfeiting and promoting sustainability.

Seamless, secure authentication enhances transparency, protects brand reputation, and delivers consumer peace of mind. FlexICs’ ultra-thin form factor provides low-profile protection that can’t be easily damaged in transit. Embedded into products or packaging, FlexICs ensure authenticity, combat counterfeiting, and build consumer trust.

As distribution grows more complex, real-time tracking of high-value or high-importance items is essential for traceability. FlexIC technology enables item-level, point-to-point traceability, reducing movement and storage errors.

Consumer electronics demand thinner, smarter designs. When traditional flex PCBs hit their limits, FlexICs’ multi-layer interconnects deliver the high routing density and flexibility to shrink your device without compromising performance.

Discrete passives eat up valuable PCB real estate, limiting form factor and system integration, while compromising aesthetics and user experience. FlexICs consolidate resistors and capacitors into a single, ultra-thin flexible chip – reducing layout complexity along with your bill of materials (BOM) enabling smaller, lighter designs without compromising function.