Webinar: More function, less space. Redefine system integration with FlexIC interconnects
As wearables and ultra-compact IoT push size limits, traditional strategies fall short. FlexIC interconnects enable a higher-density integration model to pack more into less space.
In this webinar, we explore why conventional integration approaches are struggling to keep pace with the demands of wearables and ultra-compact IoT – and what comes next. As devices shrink and functionality grows, simply optimising layout is no longer enough.
We introduce FlexIC interconnects as a new foundation for system integration, combining ultra-thin, high-density substrates with wafer-level manufacturing to enable fundamentally smaller designs.
We cover how FlexIC interconnects:
- Increase routing density with ultra-fine interconnects
- Integrate passive components directly into the substrate
- Reduce discrete component count, footprint, and system complexity
- Enable compact System-in-Package architectures on a smaller area
- Design using standard workflows while achieving next-generation density
The result: a smarter approach to building smaller, higher-performance electronic systems.
Hosted by:
Josh Young – Senior Product Manager Foundry, Pragmatic Semiconductor
Adam Reardon – Senior Emerging Applications Manager, Pragmatic Semiconductor