26-28 August 2026
World Exhibition & Convention Center, Shenzhen
3 days
From 26-28 August, join us on booth 9B25 where we’ll be showcasing our unique FlexIC technology, products and partners with our expert team on hand.
As pioneers of FlexIC technology, we are redefining IoT boundaries with flexible, ultra-thin chips, including:
Anti-counterfeit with NFC Protect – detect tampering instantly, alerting consumers to interference with just one tap of a smartphone.
Smart packaging with NFC Connect – smarter, more connected experiences and deeper levels of consumer engagement.
Miniaturisation of consumer electronics with FlexIC interconnects – a high-density integration platform for ultra-compact systems such as wearable devices.
Our SVP Sales, Business Development & Product Management, James Davey, will be on stage, alongside our Head of Sales, Asia, Alex Shang – don’t miss it!
We’ll also be hosting a series of mini tech talks, featuring some of our partners, on our booth. Come and see us for the schedule!