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FlexIC Wafer

GSA European Executive Forum 2024

GSA European Executive Forum

The GSA European Executive Forum, GSA’s premier event in Europe, took place over two days, June 18 and 19. This prestigious event convened over 250 senior executives, speakers and exhibitors around the world, solidifying its status as the premier executive event for the semiconductor industry in the EMEA region.

Pragmatic’s unique flexible integrated circuit (FlexIC) technology can open up opportunities to add intelligence to low-value products – those that do not need the cutting-edge performance of silicon chips.

Our CEO David Moore, CTO Richard Price, SVP Corporate Marketing, Communications and Public Affairs Helen Ledger and Head of Marketing Campaigns Catherine Kidd attended the conference. Complete the form below to get in touch!

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Our technology

Using thin-film transistor (TFT) technology in combination with conventional semiconductor processing equipment, our state-of-the-art, 300mm FlexIC Foundry® service takes FlexICs from tape-out to delivery in just four weeks, at a fraction of the cost of silicon.

Particularly suited to applications where form factor and cost outweigh speed and performance criteria, FlexICs excel in areas such as unique identification, multiplexing, driver circuitry, and basic computation.