Skip to main content.
FlexIC Wafer

GSA 2024

Meet us at the GSA International Semiconductor Conference

The GSA International Semiconductor Conference is a unique GSA event to London in partnership with the UK Government’s Department for Science, Innovation & Technology (DSIT) to jointly explore the impact of semiconductor innovation in anticipation to a NetZero economy.

Pragmatic’s unique flexible integrated circuit (FlexIC) technology can open up opportunities to add intelligence to low-value products – those that do not need the cutting-edge performance of silicon chips.

Our CEO David Moore, co-founder and Executive Director Scott White and SVP of Technology Catherine Ramsdale will be attending the conference. Complete the form below to arrange a meeting!

Book a meeting

Our technology

Using thin-film transistor (TFT) technology in combination with conventional semiconductor processing equipment, our state-of-the-art, 300mm FlexIC Foundry® service takes FlexICs from tape-out to delivery in just four weeks, at a fraction of the cost of silicon.

Particularly suited to applications where form factor and cost outweigh speed and performance criteria, FlexICs excel in areas such as unique identification, multiplexing, driver circuitry, and basic computation.