[Webinar] FlexICs: Bringing flexibility to electronic design

FlexICs: Bringing flexibility to electronic design

In this webinar, hosted by Electronic Design, discover how flexible integrated circuits (FlexICs) are transforming electronic design by enabling slimmer, more versatile, and highly integrated devices. Learn from industry experts how these innovative solutions can simplify designs and improve product efficiency.

What you’ll learn:

– The advantages of FlexICs in creating lighter, streamlined devices
– How FlexICs provide connect, sense, and compute capabilities
– Opportunities for FlexIC applications where traditional silicon chips are are not a viable option

Speakers:

– Alex Cronin – Commercial Director, Pragmatic Semiconductor
– Joshua Young – Senior Product Manager, Pragmatic Semiconductor

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Alex and Josh received a series of questions through from webinar attendees. Do you have a question too? Click the button below to submit a question to us and we’ll be in touch!

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Audience FAQs

How does your manufacturing process differ from the conventional silicon process?

We use fewer process steps, much lower temperatures and different materials, with no need for complex silicon preparation. This leads to shorter and more energy-efficient manufacturing compared to silicon, with significant reductions in the use of water and harmful chemicals, and a much smaller carbon footprint.

Do FlexICs require different handling compared to traditional wafers?

Not significantly. Handling is similar to traditional wafers, although a little extra care is needed due to their lighter, more flexible nature.

Can FlexICs be used on traditional printed circuit boards (PCBs)?

Yes, though the assembly method and reflow technology need to be considered. FlexICs are typically provided in bare die form, so packaging and assembly may differ slightly from traditional, silicon-based designs.

Is the circuitry passivated from environmental contaminants, humidity, etc.?

Yes, a passivation layer is included as part of the wafer-level packaging to protect against environmental contaminants.

Can metallised bonding pads be created to integrate silicon ICs via wire bonding or ball grid array (BGA)?

Yes, we support various integration methods, including wire bonding and BGA, and we’re looking to expand options, according to customer requirements.

Do you have P-type devices to make CMOS?

We currently offer N-type TFTs. We are working on improving power performance and are open to engaging with those interested in P-type devices as part of future technology advancements.