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FlexIC Wafer

DAC 2024

DAC 2024

DAC is recognized as the global event for chips to systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM’s Special Interest Group on Design Automation (SIGDA) and IEEE’s Council on Electronic Design Automation (CEDA).

Pragmatic’s unique flexible integrated circuit (FlexIC) technology can open up opportunities to add intelligence to low-value products – those that do not need the cutting-edge performance of silicon chips.

Our technology

Using thin-film transistor (TFT) technology in combination with conventional semiconductor processing equipment, our state-of-the-art, 300mm FlexIC Foundry® service takes FlexICs from tape-out to delivery in just four weeks, at a fraction of the cost of silicon.

Particularly suited to applications where form factor and cost outweigh speed and performance criteria, FlexICs excel in areas such as unique identification, multiplexing, driver circuitry, and basic computation.