As an alternative to silicon, we use thin-film technology. That makes our chips, flexible integrated circuits (FlexICs), ultra-thin – no lumps or bumps – and physically flexible, so they can go where silicon simply can’t. Even on curved or irregular surfaces.
It also makes NFC innovation more agile, slashing upfront development costs along with carbon emissions – and taking your designs from tape-out to delivery in just weeks.
Design your NFC, your way – quickly and easily. Combine the flexible intelligence of our NFC Connect product with sense and compute capabilities to detect, track and protect at scale.
Whatever your application, FlexICs deliver rapid innovation so you can deliver smarter, more secure, and more responsive products, fast.
Build, test, and scale at speed with production cycles that take days, not months. From developing proof of concepts to scaling a global product, the FlexIC Foundry accelerates innovation, cutting lead times so you can get to market faster – without the high set-up costs of traditional fabs. And it’s not just about speed. Our low-temperature process uses less energy and water, and fewer harmful chemicals, slashing the carbon footprint of fabrication – and your devices.