Four things you can do with a FlexIC (that you can’t do with silicon)

As computing becomes more distributed and more embedded, heterogeneous systems proliferate. While silicon remains unmatched for compute density and performance, FlexICs extend intelligence into places rigid chips can’t reach. Our Technology Editor, Hellen Norman, looks at four capabilities that set FlexIC technology apart.

Silicon has powered the digital era for decades. From high-performance compute to smartphones to cloud infrastructure, it remains unmatched for density and compute efficiency.

But as intelligence moves closer to where data is generated – to the edge and, ultimately, embedded within everyday objects – new constraints emerge around cost, materials, form factor, and integration.

This is where FlexICs – ultra-thin, flexible, low-cost and low-carbon – can enable a more heterogeneous model of compute and extend the semiconductor ecosystem into new spaces.

So, what can you do with a FlexIC that you can’t do with silicon?

1. Enable item-level intelligence at scale

The cost of a silicon chip can range from just a few cents to several dollars. For a high-value item like a smartphone, that’s insignificant. But for a bottle of water or a packet of meat, it’s prohibitive.

Yet for many applications, using a silicon chip is effectively over-engineering. You don’t need a high-performance processor to tell a recycling centre what type of plastic a bottle is made of, or to verify that a bottle of champagne hasn’t been tampered with.

FlexICs provide lean, ‘just enough’ intelligence. And they’re designed for a different economic reality. By using a simplified manufacturing process, they can be produced at a cost point that makes item-level tagging commercially viable for trillions of everyday objects.

This means that while silicon has the clout to power AI systems, FlexICs provide the ubiquitous, item-level data to feed them.

2. Wrap intelligence around curved surfaces

Traditional silicon chips are flat and brittle. If you try to bend them, they snap. But FlexICs are manufactured on a flexible polymer substrate, so they can bend and flex. This intrinsic flexibility allows them to conform to curves – or bend to a 5mm radius – without impairing functionality.

It also means that the form factor isn’t ‘bumpy’.

Even the smallest silicon chip requires a protective package that creates a noticeable ‘bump’. This is a deal-breaker for smart labels on high-end consumer goods or thin-film packaging where aesthetics and a premium tactile experience are paramount.

FlexICs are ultra-thin, and virtually imperceptible to the touch. They can be embedded directly into paper, plastic films, or cardboard to add smart functionality to products or packaging without impacting the look and feel. Smooth.

3. Go from design to production in weeks, not months

Silicon manufacturing is a marathon – and it’s worth it, to get a high-spec chip that meets all your needs. But between the complex front-end processing and the globalised back-end packaging, it can take months to see a finished chip.

By contrast, FlexICs’ simplified production process sees them go from tape-out to delivery in just weeks. Rapid-cycle innovation allows prototyping, testing, and iteration at a speed that traditional fabs simply can’t match, significantly reducing the time to market for new innovations.

4. Drive down your carbon footprint

Sustainability is no longer a ‘nice to have’ for global brands. It’s a core business requirement. But traditional silicon chip fabrication is one of the most resource-heavy industries on earth. It uses vast amounts of energy, thanks to production temperatures of up to 1500°C, litres and litres of ultra-pure water, and a whole host of toxic chemicals.

FlexICs are manufactured at much lower temperatures – with most steps occurring at room temperature, and none above 300°C. So fabrication uses much less energy and water and fewer harmful chemicals.

While silicon continues to lead on performance and compute density, FlexICs complement rather than compete with these strengths, extending intelligence from devices and gateways to individual items and products.

FlexICs aren’t here to replace silicon; they’re here to take electronics where silicon can’t go, leading the shift from the Internet of Things to the Internet of Everything. And reaping the efficiency and insights of a hyperconnected world.

Want to know more about FlexICs’ low carbon footprint?

Check out our report, Advancing Semiconductor Sustainability

Download the report here (PDF)

Find out more on FlexIC technology