Information

PragmatIC Semiconductor provides a unique technology platform to create ultra-low-cost flexible integrated circuits (FlexICs).

Our FlexIC Foundry® service enables designers to create their own application-specific flexible devices at a fraction of the cost and time required to develop traditional silicon ICs. Innovators use our foundry offering to iterate and test concepts within weeks, massively accelerating the development cycle. Our thin, flexible, and robust FlexICs can be easily integrated with other thin-film electronic components to create novel solutions.

PragmatIC Semiconductor intend to purchase a Physical Vapour Deposition (PVD) cluster tool to enhance its current FlexIC Foundry capabilities. 

This tender is to purchase a Physical Vapour Deposition (PVD) cluster tool. The main function of the PVD system is to deposit metal-oxide films onto a 200nmm glass substrate but the deposition chambers should be capable of upscaling to 300mm. Chambers should be connected to a cluster handling system, capable of adding additional chambers at a later stage.

Full details of PragmatIC Semiconductor requirements are provided in tender documentation which will be issued to interested parties wishing to tender.

Should you wish to express an interest in tendering and receive a copy of the tender documentation then please email tender@pragmaticsemi.com

Estimated timescales

Tender Process Start Date: 3rd August 2021                                                    

Expression of Interest Deadline: 10th August 2021

Tender Submission Deadline: 1700h 17th August 2021

Contract award date: 18th August 2021